Program for Therminic 2016 now online!

Authors are kindly reminded that the slots for their presentations may still change.

Online Program


THERMINIC 2016 will cover a wide range of thermal issues in electronic components and systems, including:

  • Thermal and Temperature Sensors
  • Acquisition and analysis of Thermal data
  • Thermal Simulation
  • Temperature Mapping
  • Electro-thermal Simulation
  • Novel and Advanced Cooling Techniques
  • Thermal Modelling & Investigation of Packages
  • Thermal Performance of Interconnects
  • Reliability Issues
  • Heat Transfer Enhancement
  • High Temperature Electronics
  • Validation of Thermal Software
  • Heat Transfer Education
  • Coupled (Thermo-mechanical, Thermo-optical, etc.) Effects

  • Flow Visualisation Techniques
  • Turbulence Modelling in Complex Geometrics
  • Thermal Stress: Theory and Experiment
  • Defect and failure modelling
  • Thermal Stress Failures: Prediction and Prevention
  • Reliability evolution and prediction
  • Multiphysics simulation
  • Nanotechnology Applications
  • Nanoengineering issues
  • Noise control
  • Education
  • 3DIC, power electronics.
  • Measurement of Thermal Properties